A comparative study of the bonding energy in adhesive wafer bonding
نویسندگان
چکیده
منابع مشابه
a comparative study of the relationship between self-, peer-, and teacher-assessments in productive skills
تمایل به ارزیابی جایگزین و تعویض آن با آزمون سنتی مداد و کاغذ در سالهای اخیر افزایش یافته است. اکثر زبان آموزان در کلاس های زبان از نمره نهایی که استاد تعیین میکند ناراضی اند. این تحقیق جهت بررسی ارزیابی در کلاس های زبان انگلیسی به هدف رضایتمندی زبان آموزان از نمره هایشان انجام گرفته است که در آن نمرات ارائه شده توسط سه گروه ارزیاب (ارزیابی خود دانشجو، همسالان واستاد) در مهارت های تولید (تکل...
15 صفحه اولHydrophobic silicon wafer bonding
Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to 1100 “C. Based on substantial differences between bonded hydrophilic and hydrophobic Si wafer pairs in the changes of the interface energy with respect to temperature, secondary ion mass spectrometry (SIMS) and transmission electron microscopy (TEM), we suggest that h...
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A variety of adhesives have been demonstrated for use in thinning and backside processing of III-V substrates. Each process exhibits certain limitations based on the adhesive’s chemical or thermal resistance. As a result, an adhesive’s property limitation may drive up costs or reduce throughput by necessitating the use of additional protective aids or special tooling. A new product developed by...
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provision of large, stress-bearing area excellent fatigue strength good shock absorption reduced galvanic corrosion no need to have access to far-side of adherend to make joint bonding is possible on dissimilar materials provision of smooth contours and sections around joint areas sealing improved damping which increases structural stiffness reduction in distortion and metal...
متن کاملWafer-to-Wafer Bonding for Microstructure Formation
Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...
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ژورنال
عنوان ژورنال: Journal of Micromechanics and Microengineering
سال: 2013
ISSN: 0960-1317,1361-6439
DOI: 10.1088/0960-1317/23/8/085019